Sep 8, 2022 · When SK hynix became the first in the industry to develop HBM3, its latest HBM (High Bandwidth Memory) product, the company not only took its place in the record books but also firmly maintained its DRAM market leadership.

Sep 26, 2024 · SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB 1, the largest capacity of existing HBM 2 to date.

SK hynix HBM3, with 1.5x capacity than HBM2E from 12 DRAM die stacked to the same total package height, is fit to power capacity-intensive applications such as AI and HPC. A single cube can yield up to 819GB/s in bandwidth, while an SiP (System-in-Package) with six HBM chips on the same silicon can achieve up to 4.8TB/s in support of exascale ...

May 2, 2024 · SK hynix, the company which first introduced high-bandwidth memory in 2014, is still the largest supplier of HBM stacks, to a large degree because it sells to Nvidia, the most successful supplier...

Jun 27, 2024 · SK Hynix has rolled out a roadmap indicating that the company will continue to dominate production of high-bandwidth memory (HBM) that is indispensable for AI. The lead that the company has gained over rival memory makers Samsung and Micron will face stiffer competition, industry experts told EE Times.

Jan 30, 2024 · SK hynix introduced HBM to the market in 2013. The technology’s x-factor is its ability to manage massive data flows at incredible speeds. Unlike conventional chips, HBM stacks layers of memory vertically, akin to a ‘data skyscraper’.

Oct 20, 2021 · SK hynix’s HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality. The latest product can process up to 819GB (Gigabyte) per second, meaning that 163 FHD (full-HD) movies (5GB each) can be transmitted in a single second.

Sep 26, 2024 · SK hynix's advanced MR-MUF technology is critical to securing a stable HBM mass production as it provides good warpage control and reduces the pressure on the chips being stacked.

SK hynix launched HBM3E to solidify it’s unrivaled leadership in AI memory market following its success with HBM3. The extended version of HBM3 helps accelerate business turnaround with its supply following industry’s largest scale of mass production of HBM.

Apr 19, 2024 · SK hynix said the collaboration between the global leader in the AI memory space and TSMC, a top global logic foundry, will lead to more innovations in HBM technology.