The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm ...

Apple will bring its next-generation M5 chip to the MacBook Pro in the fall, followed by the iPad Pro in the first half of 2026, according ...

Despite that, the M5 chip will feature TSMC’s new System on Integrated Chip (SoIC) technology, which is designed to deliver more power and energy efficiency. That may make up for the jump to 3nm.

Apple’s flagship MacBook Pro laptop is widely expected to get the M5 chip this year, but what else could we see? Here’s everything we know about it so far.

According to The Elec, the M5 chip will feature an enhanced ARM architecture and be manufactured using TSMC’s latest ... new System on Integrated Chip (SoIC) technology, which enhances thermal ...

Apple reportedly built the M5 chip using TSMC's System on Integrated Chip (SoIC) technology, improving thermal management and electrical leakage. The chip is also expected to be part of Apple's AI ...

It is used to transmit data between dies and assembled using TSMC System on Integrated Chips (SoIC) 3D stacking technology ... IGAD2DX03A is a GLink-3D high speed die-to-die interface Slave PHY. It is ...

Through its 3DFabric system, which includes the SoIC series for stacking technologies ... memory modules, substrate technology, testing, manufacturing, and packaging. (Source: TSMC) Advanced packaging ...