Abstract: This paper presents a method for forming ideal dot-shaped 3-D beams using arbitrarily arranged Frequency Diverse Arrays (FDA). Additionally, the spectrum of signals at the FDA focal point is ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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