TAIPEI (Taiwan News) — Global Unichip Corporation announced Thursday the first universal chiplet interconnect express physical layer chip made with TSMC’s N3P (3nm) process.

A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.

TSMC will begin mass production of its next-gen A16 process technology in the second half of 2026 in Taiwan, while a third ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

To prolong the excess returns enabled by leading-edge process technology, or nodes, TSMC initially focuses on logic products, mostly used on central processing units and mobile chips, then focuses ...

Tesla is getting TSMC to make its new FSD chips on its 4nm-5nm process, after the company rolls out Full Self-Driving in ...

However, when TSMC finalized its CHIPS deal with the U.S. government last year, it outlined plans to build three Fab 21 phases by 2030. Phase one includes equipment to fabricate N5 and N4 process ...