Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is ...
TL;DR: TSMC plans to build a third fab in Arizona by mid-2025, a year earlier than planned, and may establish a new CoWoS advanced packaging plant in the US. This expansion is part of TSMC's ...
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Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUsWhen Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that the company planned to serve TSMC’s customers in the state. Apple is ...
What Happened: Market chatter suggested that Nvidia's CoWoS wafer orders at TSMC had been cut from over 400,000 wafers to 380,000 wafers, fueling concerns about AI demand fluctuations. However ...
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...
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