Samsung Electronics (OTCPK:SSNLF) intends to use a chip making technology favored by rival SK Hynix as ... while Hynix switched to the mass reflow molded underfill, or MR-MUF, method to address ...

HBM is in high demand, particularly for U.S. chip ... SK hynix's leadership in the HBM market to its development of key packaging technologies, including mass reflow-molded underfill (MR-MUF ...

SEOUL (Reuters) - SK Hynix shares jumped more than 9% on Thursday after the South Korean firm started mass ... HBM chips, which aid in the processing of vast amounts of data to train AI technology ...

Due to the nature of HBM ... through the mass reflow (MR) process. After that, the underfill process is carried out for insulation. SK hynix refers to this process as MR-MUF (Molded Underfill).