Efficient Power Conversion (EPC) has released its Phase 18 Reliability Report, providing new insights into eGaN device ...
Efficient Power Conversion (EPC) released its Phase 18 Reliability Report, which describes updated approaches for evaluating eGaN device reliability across application mission profiles. The report ...
Closing the gap between lab-generated reliability testing and real-world mission profiles By identifying intrinsic ...
Researchers at The University of Osaka have developed a novel technique to enhance the performance and reliability of silicon carbide (SiC) metal-oxide-semiconductor (MOS) devices, a key component in ...
The magnetically actuated peel test developed by Georgia Tech researchers tests the stresses to which microelectronic chips are subjected. (Image courtesy of Greg Ostrowicki and Suresh Sitaraman) ...
Failure rate or base failure rate refers to the number of failures per unit of time, typically in terms of failures in time (FITs) equivalent to one failure in a billion hours, which can be expected ...
New AEC-Q100 Grade 1 MRAM Delivers 10-Year Data Retention at 125°C, 48-Hour Burn-In, and Unlimited Endurance for Mission-Critical Systems CHANDLER, Ariz.--(BUSINESS WIRE)-- Everspin Technologies, Inc.
As electronic devices continue to become more compact, flexible, and wearable, materials suppliers are coming under increased pressure to surpass traditional limitations. From foldable displays and ...
Why it’s necessary to categorize physical-layer features under three segments: robustness, reliability and range. Why it’s crucial to understand the distinction between robustness (signal integrity ...
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