A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Modern CARE PACKAGE kits A woman in Cebu Province in the Philippines collects a CARE PACKAGE kit for her family at a distribution site set up after an earthquake in October 2025. The Philippines was ...

CRU Inc.'s new Digital Cinema Package Kits can be ordered with or without pre-formatted EXT3 disk drives (ISDCF specification). Two versions are available and include the industry-standard DX115 DC ...

CARE aims to deliver up to one million modern CARE PACKAGE kits, reaching two million people worldwide and in the United States, by 2030. A woman in Cebu Province in the Philippines collects a CARE ...