A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
A new technique uses standard chip fab methods to fabricate the building block of a timing device, critical to all microprocessors. Currently, this timing device, known as an acoustic resonator, must ...
IC Compiler II and Design Compiler Graphical provide a complete digital implementation flow delivering optimized power, performance, area, and full via pillar support StarRC, PrimeTime, NanoTime, and ...
Several chipmakers are making some major changes in the characterization/metrology lab, adding more fab-like processes in this group to help speed up chip development times. The ...
Hsinchu, Taiwan – Attopsemi, a pioneering provider of innovative One-Time Programmable (OTP) IP solutions, today announced a significant technological leap: its proprietary I-fuse® technology has ...
TSMC's board of directors has approved a budget of about US$2.89 billion for installation of mature technology capacity, the pure-play foundry announced on April 22. The planned investment is to ...
Applied Materials, the number one supplier of silicon chip fabrication systems to every big-name player (Intel, IBM, AMD, TMSC, Samsung...) has revealed the first commercial machine that can create ...
Taiwan Semiconductor Manufacturing Company (TSMC) is on track to launch the much-awaited 3-nm process node in September, according to media reports in Taiwan, and Apple will be its first 3-nm customer ...
Just a few days after TSMC provided details of its 3-nm process node at the company’s 2022 North America Technology Symposium, there are reports that fab archrival Samsung is starting its 3 nm-based ...
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