FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

Improvements in the deposition of copper will usher in new ultralarge-scale ICs. Copper has become the material of choice for fabricating connections on ultralarge scale integrated circuits. The ...

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...

An international research group has achieved a 22.1% power conversion efficiency in a bifacial heterojunction crystalline solar cell fabricated through copper (Cu) plating metallization. “We developed ...