It will allow Applied to develop co-optimized solutions for fine-pitch I/O wiring, and accelerate advanced packaging roadmaps ...

Lam Research Corporation LRCX sees advanced packaging as a major growth driver for its Systems segment sales in fiscal 2026. The company crossed $1 billion in advanced packaging-related revenues in ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Applied Materials will acquire NEXX from ASMPT Limited to enhance its panel-level advanced packaging technology for AI accelerators. The acquisition, which does not require regulatory approval, will ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

Bruker Corporation BRKR recently announced the shipment and installation of its 15th InSight WLI 3D optical metrology system for a leading semiconductor manufacturer. The installation is part of a ...